Optimization of fins used in electronic packaging

Autor:	Eu Ong, Kang, Oon Lee, Kor, Seetharamu, K.N., Azid, I.A., Quadir, G.A., Zainal, Z.A., Joo Goh, Teck
Zdroj:	Microelectronics International: An International Journal, 2005, Vol. 22, Issue 1, pp. 10-15.
Databáze:	Emerald Insight
Externí odkaz:	http://www.emeraldinsight.com/doi/10.1108/13565360510575495 Zobrazit plný text záznamu