Substrate integrated packaging for RF‐applications

Autor:	Richter, H., Ferling, D., Buchali, F., Heck, W.
Zdroj:	Microelectronics International: An International Journal, 2000, Vol. 17, Issue 1, pp. 31-36.
Databáze:	Emerald Insight
Externí odkaz:	http://www.emeraldinsight.com/doi/10.1108/13565360010306056 Zobrazit plný text záznamu