Effect of solder joint integrity on the thermal performance of a TEC for a 980 nm pump laser module
| Autor: | Takyi, G., Amalu, E.H., Bernasko, P.K. |
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| Zdroj: | Soldering & Surface Mount Technology, 2011, Vol. 23, Issue 2, pp. 115-119. |
| Databáze: | Emerald Insight |
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