Investigation of Sn‐Zn‐Bi solders – Part II: wetting measurements on Sn‐Zn7Bi solders on copper and on PCBs with lead‐free finishes by means of the wetting balance method

Autor:	Bukat, K., Sitek, J., Kościelski, M., Moser, Z., Gąsior, W., Pstruś, J.
Zdroj:	Soldering & Surface Mount Technology, 2010, Vol. 22, Issue 4, pp. 13-19.
Databáze:	Emerald Insight
Externí odkaz:	http://www.emeraldinsight.com/doi/10.1108/09540911011076844 Zobrazit plný text záznamu