Effect of ENIG deposition on the failure mechanisms of thermomechanically loaded lead‐free 2nd level interconnections in LTCC/PWB assemblies

Autor:	Nousiainen, O., Kangasvieri, T., Kautio, K., Rautioaho, R., Vähäkangas, J.
Zdroj:	Soldering & Surface Mount Technology, 2010, Vol. 22, Issue 3, pp. 22-35.
Databáze:	Emerald Insight
Externí odkaz:	http://www.emeraldinsight.com/doi/10.1108/09540911011054163 Zobrazit plný text záznamu