Investigation of the effect of nitrogen and air atmospheres on solder wettability of plasma‐treated HASL finish PCBs

Autor:	Takyi, G., Ekere, N.N.
Zdroj:	Soldering & Surface Mount Technology, 2010, Vol. 22, Issue 3, pp. 17-21.
Databáze:	Emerald Insight
Externí odkaz:	http://www.emeraldinsight.com/doi/10.1108/09540911011054154 Zobrazit plný text záznamu