Moisture effects on adhesion of non‐conductive adhesive attachments

Autor:	Saarinen, Kirsi, Heino, Pekka
Zdroj:	Soldering & Surface Mount Technology, 2010, Vol. 22, Issue 1, pp. 41-46.
Databáze:	Emerald Insight
Externí odkaz:	http://www.emeraldinsight.com/doi/10.1108/09540911011015139 Zobrazit plný text záznamu