Design, materials, and assembly process of high‐density packages with a low‐temperature lead‐free solder (SnBiAg)
| Autor: | Lau, John, Gleason, Jerry, Schroeder, Valeska, Henshall, Gregory, Dauksher, Walter, Sullivan, Bob |
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| Zdroj: | Soldering & Surface Mount Technology, 2008, Vol. 20, Issue 2, pp. 11-20. |
| Databáze: | Emerald Insight |
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