Effect of Ag content on wetting properties and solidus temperature of Sn‐8.5Zn‐xAg‐0.01Al‐0.1Ga lead‐free solders

Autor: Lai, R.S., Lin, K.L., Salam, B.
Zdroj: Soldering & Surface Mount Technology, 2008, Vol. 20, Issue 1, pp. 22-26.
Databáze: Emerald Insight
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