Characterization of SnAgCu and SnPb solder joints on low‐temperature co‐fired ceramic substrate

Autor:	Zhong, Z.W., Arulvanan, P., Phone Maw, Hla, Lu, C.W.A.
Zdroj:	Soldering & Surface Mount Technology, 2007, Vol. 19, Issue 4, pp. 18-24.
Databáze:	Emerald Insight
Externí odkaz:	http://www.emeraldinsight.com/doi/10.1108/09540910710848518 Zobrazit plný text záznamu