Reliability testing and data analysis of lead‐free solder joints for high‐density packages

Autor:	Lau, John, Hoo, Nick, Horsley, Rob, Smetana, Joe, Shangguan, Dongkai, Dauksher, Walter, Love, Dave, Menis, Irv, Sullivan, Bob
Zdroj:	Soldering & Surface Mount Technology, 2004, Vol. 16, Issue 2, pp. 46-68.
Databáze:	Emerald Insight
Externí odkaz:	http://www.emeraldinsight.com/doi/10.1108/09540910410537336 Zobrazit plný text záznamu