CBGA solder joint thermal fatigue life estimation by a simple method
Autor: | Wong, T.E., Lau, C.Y., Fenger, H.S. |
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Zdroj: | Soldering & Surface Mount Technology, 2004, Vol. 16, Issue 2, pp. 41-45. |
Databáze: | Emerald Insight |
Externí odkaz: |
Autor: | Wong, T.E., Lau, C.Y., Fenger, H.S. |
---|---|
Zdroj: | Soldering & Surface Mount Technology, 2004, Vol. 16, Issue 2, pp. 41-45. |
Databáze: | Emerald Insight |
Externí odkaz: |