Fatigue crack growth behaviour of lead‐containing and lead‐free solders
Autor: | Mutoh, Y., Zhao, J., Miyashita, Y., Kanchanomai, C. |
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Zdroj: | Soldering & Surface Mount Technology, 2002, Vol. 14, Issue 3, pp. 37-45. |
Databáze: | Emerald Insight |
Externí odkaz: |