A methodology to establish baseline metrics for assessing the isothermally aging of Sn‐Pb solder interconnects
| Autor: | Vianco, P.T., Rejent, J.A. |
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| Zdroj: | Soldering & Surface Mount Technology, 2002, Vol. 14, Issue 2, pp. 26-34. |
| Databáze: | Emerald Insight |
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