The impact of process parameters on gold elimination from soldered connector assemblies

Autor:	Vianco, P.T., Kilgo, A.C.
Zdroj:	Soldering & Surface Mount Technology, 2000, Vol. 12, Issue 2, pp. 24-31.
Databáze:	Emerald Insight
Externí odkaz:	http://www.emeraldinsight.com/doi/10.1108/09540910010331400 Zobrazit plný text záznamu