3D FEM models for numerical simulation of induction sealing of packaging material

Autor:	Babini, A., Borsari, R., Fontanini, A., Dughiero, F., Forzan, M.
Zdroj:	COMPEL -The international journal for computation and mathematics in electrical and electronic engineering, 2003, Vol. 22, Issue 1, pp. 170-180.
Databáze:	Emerald Insight
Externí odkaz:	http://www.emeraldinsight.com/doi/10.1108/03321640310452268 Zobrazit plný text záznamu