Solder bridging test to evaluate the compatibility for fine‐pitch microsoldering

Autor:	Takemoto, Tadashi, Funaki, Tatsuya, Miyazaki, Makoto, Matsunawa, Akira
Zdroj:	Circuit World, 1998, Vol. 24, Issue 1, pp. 39-44.
Databáze:	Emerald Insight
Externí odkaz:	http://www.emeraldinsight.com/doi/10.1108/030561201998000007 Zobrazit plný text záznamu