Electrical and thermal characterization of (250 °C) SiC power module integrated with LTCC-based isolated gate driver

Autor: Ahmed, Salahaldein, Lai, Pengyu, Chinnaiyan, Sudharsan, Mantooth, Alan, Chen, Zhong
Zdroj: In e-Prime - Advances in Electrical Engineering, Electronics and Energy March 2024 7
Databáze: ScienceDirect