Robust and reversible adhesion under extreme thermal conditions
| Autor: | Chen, Jian, Ji, Keju, Xu, Chi, Zhao, Jiahui, Huo, Tingwei, Song, Yi, Gorb, Stanislav N., Long, Yi, Dai, Zhendong |
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| Zdroj: | In Device 19 January 2024 2(1) |
| Databáze: | ScienceDirect |
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