Immunological mechanism of Sr/Cu ion synergistically promote implant osseointegration
| Autor: | Wang, Lei, Yang, Xin, Zheng, Weiwei, Huang, Degang, Zhang, Yinchang, He, Huazheng, Xiong, Shouliang, Li, Congming, Wang, Chao, Lin, Haoran, Chen, Pingbo, Ye, Tingjun, Yang, Xing, Wang, Qiang |
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| Zdroj: | In Materials Today Advances December 2023 20 |
| Databáze: | ScienceDirect |
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