Comprehensive comparative analysis of microstructure of Sn–Ag–Cu (SAC) solder joints by traditional reflow and thermo-compression bonding (TCB) processes

Autor: Hah, Jinho, Kim, Youngja, Fernandez-Zelaia, Patxi, Hwang, Sungkun, Lee, Sangil, Christie, Leroy, Houston, Paul, Melkote, Shreyes, Moon, Kyoung-Sik, Wong, Ching-Ping
Zdroj: In Materialia June 2019 6
Databáze: ScienceDirect
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