Bioinspired low temperature Cu bonding interfaces with interlocked microstructures to achieve high reliability
| Autor: | Cao, Peilin, Wang, Cong, Liu, Linpeng, Ding, Kaiwen, He, Jiahua, Yan, Dejin, Lin, Nai, Duan, Ji'an |
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| Zdroj: | In Surfaces and Interfaces August 2024 51 |
| Databáze: | ScienceDirect |
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