Experimental and computational studies on TAD as an additive of copper chemical mechanical polishing
Autor: | Huo, Jinxiang, Gao, Baohong, He, Bin, Li, Wenhaoyu, Liang, Bin, Liu, Mingyu, Chen, Xuhua |
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Zdroj: | In Surfaces and Interfaces July 2024 50 |
Databáze: | ScienceDirect |
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