Covalently bonded silica interfacial layer for simultaneously improving thermal and dielectric performance of copper/epoxy composite
| Autor: | Zheng, Kun, Wang, Dan, Duo, Leijiao, Sun, Fangyuan, Zhang, Zongbo, He, Yifan, Li, Pengfei, Ma, Yongmei, Xu, Caihong |
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| Zdroj: | In Surfaces and Interfaces October 2021 26 |
| Databáze: | ScienceDirect |
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