Microstructure and morphology of the soldering interface of Sn–2.0Ag–1.5Zn low Ag content lead-free solder ball and different substrates
| Autor: | Xiao, Jin, Tong, Xing, Liang, Jinhui, Chen, Quankun, Tang, Qiming |
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| Zdroj: | In Heliyon February 2023 9(2) |
| Databáze: | ScienceDirect |
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