Achieving Reliable CoSb3 based thermoelectric joints with low contact resistivity using a high-entropy alloy diffusion barrier layer
| Autor: | Sun, Z., Chen, X., Zhang, Juncheng, Geng, Huiyuan, Zhang, L.X. |
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| Zdroj: | In Journal of Materiomics July 2022 8(4):882-892 |
| Databáze: | ScienceDirect |
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