Al-clad Cu bond wires for power electronics packaging: Microstructure evolution, mechanical performance, and molecular dynamics simulation of diffusion behaviors
| Autor: | Liu, Wenting, Wang, Xinyue, Zhang, Jing, Zhang, Guoqi, Liu, Pan |
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| Zdroj: | In Materials Today Communications December 2024 41 |
| Databáze: | ScienceDirect |
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