High-reliability Sn37Pb/Sn58Bi composite solder joints by solid-liquid low-temperature soldering

Autor: Ye, Zi-Ting, Zhao, Xiuchen, Xie, Xiaochen, Chang, Jiahui, Chen, Weiwei
Zdroj: In Materials Today Communications December 2024 41
Databáze: ScienceDirect