Effect of Al particles addition on microstructure and shear properties of Cu/Sn-1Zn/Cu composite solder joints by transient liquid phase bonding
| Autor: | Li, Yinghao, Wang, Chunxia, Liang, Shujun, Li, Yunxiang, Li, Chao |
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| Zdroj: | In Materials Today Communications August 2024 40 |
| Databáze: | ScienceDirect |
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