Study on interface diffusion and welding strength of Cu/Sn dissimilar metal electromagnetic pulse welding based on molecular dynamics simulation
| Autor: | Zhang, Long, Duan, Xuemei, Tian, Zu-an, He, Yiwen, Hu, Yongliang, Yin, Limeng, Xie, Jilin |
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| Zdroj: | In Materials Today Communications August 2024 40 |
| Databáze: | ScienceDirect |
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