Hot deformation behavior and dynamic recrystallization mechanisms of a Mn-Cu damping alloy
| Autor: | Huang, Yao, Wang, Yuqi, Yu, Shan, Zhang, Hexin, Zhao, Chengzhi |
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| Zdroj: | In Materials Today Communications August 2024 40 |
| Databáze: | ScienceDirect |
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