Tuning heterogeneous geometric microstructure of Cu-based materials via powder metallurgy for improving high synergistic strengthening and electrical conductivity

Autor: Xiong, Shiyu, Li, Shaoyu, Wei, Jianlei, Zhou, Huarui, Zhu, Qiqing, Liu, Baixiong, Zeng, Longfei
Zdroj: In Materials Today Communications March 2024 38
Databáze: ScienceDirect