Orthogonal design optimization for Cu/Sn58Bi-0.4Mg/Cu solder joint strength in ultrasonic-assisted soldering
| Autor: | Huang, Xi, Zhang, Liang, Zhang, Jia-Min, Chen, Chen, Lu, Xiao, Sun, Lei |
|---|---|
| Zdroj: | In Materials Today Communications March 2024 38 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
|
Full Text from ScienceDirect