Research progress of interfacial adhesion force of copper plating on Ajinomoto build-up films for chip substrates
| Autor: | Ding, Shanjun, Fang, Zhidan, Yu, Zhongyao, Wang, Qidong |
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| Zdroj: | In Materials Today Communications December 2023 37 |
| Databáze: | ScienceDirect |
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