Study on microstructure control of copper-tin biphase interface in hot-dip tin-plated electronic copper strip
| Autor: | Ouyang, Yulu a, Liu, Yahui b, ⁎, Zhu, Qianqian a, Zhang, Guoshang c, ⁎⁎, Song, Kexing c, Huang, Tao a, Lu, Weiwei d, Liu, Dong e, Liu, Aikui e, Wang, Binbin a, Li, Qi a |
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| Zdroj: | In Journal of Materials Research and Technology November-December 2024 33:7169-7181 |
| Databáze: | ScienceDirect |
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