Properties of Sn-3.0Ag-0.5Cu solder joints under various soldering conditions: Reflow vs. Laser vs. Intense Pulsed Light soldering
| Autor: | Noh, Eun-Chae, Lee, Hyo-Won, Kim, Jong-Woong, Jung, Seung-Boo, Yoon, Jeong-Won |
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| Zdroj: | In Journal of Materials Research and Technology November-December 2024 33:6622-6632 |
| Databáze: | ScienceDirect |
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