Ni/Ti Amed part/substrate interface reconfiguration under electropulsing
Autor: | Chen, Hao a, Qin, Shuyang a, ⁎, Men, Shibo a, Kong, Xuemeng a, Wang, Di a, Chen, Zuqiang b, Guo, Chaoran a, Geng, Yanfei b, Wang, Yanhu b, c, Chen, Xizhang b, c, Ji, Ce a, Wang, Pengfei a, Huang, Huagui a, ⁎⁎ |
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Zdroj: | In Journal of Materials Research and Technology November-December 2024 33:5898-5908 |
Databáze: | ScienceDirect |
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