Through glass via (TGV) copper metallization and its microstructure modification
| Autor: | Chang, Yu-Hsun, Lin, Yu-Ming, Lee, Cheng-Yu, Hsu, Pei-Chia, Chen, Chih-Ming, Ho, Cheng-En |
|---|---|
| Zdroj: | In Journal of Materials Research and Technology July-August 2024 31:1008-1016 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
|