Evolution mechanism of rapid solidification microstructure of an undercooled copper-based single phase alloy

Autor: Du, Wenhua, Hou, Kai, Xu, Xuguang, Saad, Ismal, Hsien, Willey Liew Yun, Hongen, An, Siambun, Nancy Julius, Chuab, Bih-Lii, Hongfu, Wang
Zdroj: In Journal of Materials Research and Technology July-August 2024 31:1184-1190
Databáze: ScienceDirect