Evolution mechanism of rapid solidification microstructure of an undercooled copper-based single phase alloy
Autor: | Du, Wenhua, Hou, Kai, Xu, Xuguang, Saad, Ismal, Hsien, Willey Liew Yun, Hongen, An, Siambun, Nancy Julius, Chuab, Bih-Lii, Hongfu, Wang |
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Zdroj: | In Journal of Materials Research and Technology July-August 2024 31:1184-1190 |
Databáze: | ScienceDirect |
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