Effect of Si3N4 nanoparticles on IMC as well as mechanical properties of Sn58Bi/Cu solder joints during thermal aging
| Autor: | Deng, Kai, Zhang, Liang, Chen, Mo, Huang, Peipei |
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| Zdroj: | In Journal of Materials Research and Technology May-June 2024 30:9140-9147 |
| Databáze: | ScienceDirect |
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