Multi-factor coupled failure mechanism of W–Cu functionally graded material under thermal shock service

Autor: Chen, Pengqi, Xu, Dang, Huang, Chengyang, Yang, Jian, Tai, Yunxiao, Hong, Tao, Cheng, Jigui, Chen, Hongyu
Zdroj: In Journal of Materials Research and Technology November-December 2023 27:5082-5092
Databáze: ScienceDirect