Multi-factor coupled failure mechanism of W–Cu functionally graded material under thermal shock service
Autor: | Chen, Pengqi, Xu, Dang, Huang, Chengyang, Yang, Jian, Tai, Yunxiao, Hong, Tao, Cheng, Jigui, Chen, Hongyu |
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Zdroj: | In Journal of Materials Research and Technology November-December 2023 27:5082-5092 |
Databáze: | ScienceDirect |
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