Transient liquid phase bonding using Cu foam and Cu–Sn paste for high-temperature applications
| Autor: | Heo, Min-Haeng, Seo, Young-Jin, Yoon, Jeong-Won |
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| Zdroj: | In Journal of Materials Research and Technology November-December 2023 27:2856-2867 |
| Databáze: | ScienceDirect |
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