Contribution of grain boundary to strength and electrical conductivity of annealed copper wires
| Autor: | Dong, Liming, Yang, Fei, Yu, Tianbo, Zhang, Ning, Zhou, Xuefeng, Xie, Zonghan, Fang, Feng |
|---|---|
| Zdroj: | In Journal of Materials Research and Technology September-October 2023 26:1459-1468 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
|