Recent advances in Sn-based lead-free solder interconnects for microelectronics packaging: Materials and technologies
| Autor: | Dele-Afolabi, T.T., Ansari, M.N.M., Azmah Hanim, M.A., Oyekanmi, A.A., Ojo-Kupoluyi, O.J., Atiqah, A. |
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| Zdroj: | In Journal of Materials Research and Technology July-August 2023 25:4231-4263 |
| Databáze: | ScienceDirect |
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