Capillary filling ability of Sn-Zn solder on SiC ceramic surface under electromagnetic ultrasonic action

Autor: Zhang, Mingxuan, Ma, Zhipeng, Geng, Dai, Xia, Fafeng, Yu, Xinlong
Zdroj: In Journal of Materials Research and Technology March-April 2023 23:2836-2851
Databáze: ScienceDirect