Capillary filling ability of Sn-Zn solder on SiC ceramic surface under electromagnetic ultrasonic action
Autor: | Zhang, Mingxuan, Ma, Zhipeng, Geng, Dai, Xia, Fafeng, Yu, Xinlong |
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Zdroj: | In Journal of Materials Research and Technology March-April 2023 23:2836-2851 |
Databáze: | ScienceDirect |
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