Impact of electromigration and isothermal ageing on lead-free solder joints of chip-sized SMD components
| Autor: | Straubinger, Dániel, Hurtony, Tamás, Géczy, Attila |
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| Zdroj: | In Journal of Materials Research and Technology November-December 2022 21:308-318 |
| Databáze: | ScienceDirect |
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