Interface evolution and mechanical properties of Sn–36Pb–2Ag solder joints under different aging conditions
| Autor: | Li, Rui, Cong, Sen, Mei, Jiancheng, Zhang, Le, Chen, Zhuo, Li, Ting, Yuan, Xinjian |
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| Zdroj: | In Journal of Materials Research and Technology January-February 2021 10:868-881 |
| Databáze: | ScienceDirect |
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