Artifact-free microstructures of the Cu–In reaction by using cryogenic broad argon beam ion polishing
| Autor: | Hung, H.T., Lee, P.T., Tsai, C.H., Kao, C.R. * |
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| Zdroj: | In Journal of Materials Research and Technology November-December 2020 9(6):12946-12954 |
| Databáze: | ScienceDirect |
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