Influence of graphene content and nickel decoration on the microstructural and mechanical characteristics of the Cu/Sn–Ag–Cu/Cu soldered joint

Autor: Sayyadi, R., Khodabakhshi, F., Javid, N. Shahamat, Khatibi, G.
Zdroj: In Journal of Materials Research and Technology July-August 2020 9(4):8953-8970
Databáze: ScienceDirect