Influence of bismuth (Bi) addition on wetting characteristics of Sn-3Ag-0.5Cu solder alloy on Cu substrate

Autor: Erer, Ahmet Mustafa, Oguz, Serkan, Türen, Yunus
Zdroj: In Engineering Science and Technology, an International Journal December 2018 21(6):1159-1163
Databáze: ScienceDirect